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Table R5 Physical Characteristics and Environmental Specifications for Radial-leaded Devices
BBRF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
Tin-plated copper, 0.52mm 2 (20AWG), ?0.81mm (0.032in.)
Solderability per ANSI/J-STD-002 Category 3
per IEC-STD 68-2-20, Test Tb, Method 1A, Condition B, can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
-40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
RXEF
Physical Characteristics
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
Lead material
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
RXEF005 : Tin-plated nickel-copper alloy, 0.128mm 2 (26AWG), ?0.40mm (0.016in.)
RXEF010 : Tin-plated nickel-copper alloy, 0.205mm 2 (24AWG), ?0.51mm (0.020in.)
RXEF017 to 040 : Tin-plated copper-clad steel, 0.205mm 2 (24AWG), ?0.51mm (0.020in.)
RXEF050 to 090 : Tin-plated copper, 0.205mm 2 (24AWG), ?0.51mm (0.020in.)
RXEF110 to 375 : Tin-plated copper, 0.52mm 2 (20AWG), ?0.81mm (0.032in.)
Solderability per ANSI/J-STD-002 Category 3
RXEF005, RXEF010 meet ANSI/J-STD-002 Category 1
RXEF005- RXEF025: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a;
can withstand 5 seconds at 260°C ±5°C
All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b;
can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
-40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
Environmental Specifications
12
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
RKEF
Physical Characteristics
Conditions
-40°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±10%
±10%
No change
Lead material
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
RKEF050 to 090 : Tin-plated copper, 0.205mm 2 (24AWG), ?0.51mm (0.020in.)
RKEF110 to 500 : Tin-plated copper, 0.52mm 2 (20AWG), ?0.81mm (0.032in.)
Solderability per ANSI/J-STD-002 Category 3
RKEF050-RKEF185 : per IEC-STD 68-2-20, Test Tb, Method 1a, condition a;
can withstand 5 seconds at 260°C ±5°C
All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b;
RKEF can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
-40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
150
RoHS Compliant, ELV Compliant
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